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Ansys Q3D Extractor


Ansys Q3D Extractor can extract the parasitic parameters (resistance as R, inductance as L, capacitance as C, conductance as G) after electromagnetic field computing based on the structures of electronic components, and generate SPICE/IBIS equivalent circuit models. As the working speed and complexity of the electronics evolve, the effects of reflection, transmission delay, crosstalk, and synchronous switching noise (SSN) in the system are becoming more significant. The system performance can now only be ensured by having a precise simulation of the electromagnetic parasitic effects from complex structures such as packages, connectors, vias, cables, etc. in the system. Ansys Q3D Extractor uses the boundary element method (BEM) to quickly solve the electromagnetic parasitic parameters based on the structure shapes and the material characteristics, then conducts bidirectional coupling simulation with the Ansys structure/fluid software.


3D quasi-static magnetic field solver
The Ansys Q3D Extractor includes an advanced quasi-static 3D electromagnetic field solver based on the method of moments (MoM) and speeded up with the fast multipole method (FMM). The results include proximity and skin effects, dielectric and ohmic losses, as well as frequency dependence. Q3D Extractor can easily and rapidly provide the extraction of 3D resistance (R), partial inductance (L), capacitance (C), and conductance (G).
2D Extractor: cable and transmission line field solver
The 2D Extractor is an analytical tool for cables and transmission lines. It uses the finite element method (FEM) to calculate the RLCF parameters of each unit of length, characteristic impedance (Z0) matrix, propagation velocity, delay time, attenuation, the effective dielectric constant, differential/common mode parameters, and the crosstalk constant.
Product features
◆   Automatic adaptive meshing
The automatic adaptive meshing technology only requires the designated geometric shape, material properties, and the required output to operate. The meshing process uses robust volumetric meshing technologies and includes multithreaded functions. Such a function can reduce the needed memory and speed up the simulation. This verified technology can eliminate the complexity to construct and complete finite element mesh and enable advanced numerical analysis in all simulation stages.
   Equivalent circuit model creation
Ansys Q3D Extractor can be utilized to create equivalent circuit models (SPICE subcircuit/ladder-type lumped model). The types of models that Q3D Extractor generates depend on the used solver. The most common formats for the creation of 2D and 3D solvers are Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG model, and Ansys CPP model. It is extracted through the Q3D extractor RLC, an extractor equipped with power converters without ideal switch characteristics.
   IBIS packaging model extraction
It can generate reduced-order SPICE models with high-precision that can be used for circuit simulation, making Ansys Q3D Extractor the ideal software to make IBIS packaging models. Users can study crosstalk, ground bounce, interconnect delay, and ringing, which brings help to understand the performance of high-speed electric designs, such as multilayer printed circuit boards, advanced electronic packaging, and passive components on 3D chips. Furthermore, the Q3D Extractor can be used for the extraction of key interconnect components in the packaging (bondwires), the critical interconnect components on the circuit board (critical nets), and the connection paths between the chip, package, and circuit board (i.e. connectors, cables, sockets, and transmission lines). ).
   Power converter design
Ansys Q3D Extractor is the ideal option for designing electronic equipment for hybrid electric technology and power distribution, as it optimizes the inverter/converter architecture and minimizes overvoltage conditions, short-circuit current, and bus inductance. The software extracts resistance, part of the inductance, and parasitic capacitance from high-power buses, cables, and high-power inverter/converter modules, and then imports them into Ansys Twin Builder to study the EMI/EMC performance of electronic systems. It can be connected with Ansys Icepak and Ansys Mechanical to study the electrothermal stress caused by the current.
◆  Touch screen design
With Q3D Extractor, you can solve design difficulties by analyzing the RLCG matrix of touch-screen devices. It is capable of effectively solving thin conductive layers (such as ITO), allowing the solution to be 22 times faster than the traditional thick metal solutions.