【Technical notes】Reflow solution of LED mounting component
2021.02.26
In the mounting process of the substrate and the electronic device components, the optimum temperature for mounting heating has conventionally been 183 degrees Celsius in the case of eutectic solder. At present, the temperature is rising to around 220-230 degrees Celsius with the change of the adhesive material due to the “lead-free”. As a result, the temperature stress applied to electronic device components and substrates has become more severe than ever.
Such a situation causes a serious problem of defective mounting of the entire board. Ansys provides a solution to the above problem by using the results of thermal fluid analysis as a load and performing stress analysis, on Ansys Workbench environment.
This solution will help you better solve below problems during your development:
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Difficult to set optimum furnace temperature. Detailed temperature distribution in the furnace and mounted components cannot be grasped.
Investigate the cause of possible defects in mounted components after reflow
Effective measures cannot be taken due to little information obtained in actual machine tests
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Conduct solder crack growth analysis
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Implementation of analysis considering solder creep characteristics
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[C12] Reflow solution of LED mounting component
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2021-02-26 10:51:00
2021-02-26 10:51:00 |
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