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Structure, Drop, and Impact Analysis |
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Including structure stress analysis, heat transfer analysis, fatigue analysis, nonlinear material analysis, dropping and impact analysis, etc., it is an essential CAE tool for structural analysis.
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Focus on display solution analysis applications such as dropping, collision, stamping, forging, breakage, etc., which can analyze structural deformation / destruction phenomena in a short time.
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It can analyze the mechanism system, and conduct rapid and accurate analysis of rigid bodies (without mesh) and flexible bodies at the same time, including loading analysis of mechanism connectors, multibody dynamics analysis, etc.
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Analysis software based on physics / physics of failure (PoF) can simulate and analyze PCB reliability, including solder fatigue, CAF, TCT, etc.
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Fluids and Heat Flow Analysis |
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Professional heat flow calculation software, including heat transfer analysis, fluid analysis, Newtonian/non-Newtonian fluids analysis, phase change, chemical reaction, etc. It is the most comprehensive heat transfer fluid analysis tool.
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Optics, Photonics, and Lighting Analysis |
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A complete photonics simulation software solution for the design of photonics components, circuits, and systems.
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The industry standard software for optical systems and component design.
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A powerful, proven optical simulation software for lighting and ilumination systems simulation.
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Electromagnetic Field Analysis |
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High-frequency 3D electromagnetic analytical software, which can analyze electromagnetic fields of any 3D structure, and is used to design high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed connectors, IC packages, and printed circuit boards.
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High-frequency 3D and 2D quasi-static electromagnetic field simulation software can extract RLCG parameters from the structure and generate equivalent SPICE sub-circuit models. The model can be used for signal integrity analysis to understand the performance of IC packages, connectors, and printed circuit boards (PCBs).
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Design simulation platform for high-frequency IC packaging and printed circuit boards, which can realize the power integrity, signal integrity and EMI analysis of IC packaging and PCB.
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A platform-level electromagnetic modeling simulation tool capable of simulating cables, specifically to analyze electromagnetic (EM) effects caused by lightning strikes on large platforms and cable EMI / EMC problems in various large platforms.
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Low-frequency electromagnetic field analytical software, used in motors, transformers, solenoid valves, wireless charging, etc., to calculate electromagnetic losses, electromagnetic force, magnetic flux, and current density.
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Specialized electronic thermal dissipation analytical software , including various fast modeling modules, such as fans, ICs, refrigeration chips, etc., and importing PCB ECAD files to calculate heat transfer performance.
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Fast motor characteristic analysis software, including electromagnetic, heat dissipation, dynamic electromagnetic and heat transfer coupling analysis and structural analysis, is the most comprehensive design analysis tool in the initial design stage.
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3D Design Analysis |
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The real-time heat flow and structural design simulation platform can quickly obtain the change result of CAE phenomenon according to the change of the model, which is suitable for the design evaluation tool in the CAD design stage.
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A tool for fast modeling and repair, which can read ECAD, MCAD and other files, and the intuitive modeling and repair method can quickly modify model features.
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Materials |
Embedded Software (Systems Analysis) |
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A material library with a variety of brands and material classifications can be combined with any material library of Ansys analysis software and quickly applied in modeling analysis.
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Ansys SCADE
Model-based embedded software development and test verification platform for highly safety-critical applications, supporting system design, control logic modeling, human-machine interface graphic display design, certification-level automatic code generation, complete software testing and verification environment, software requirement tracking and Automatic report generator.
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Safety Analysis |
Digital Twin |
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ANSYS medini analyze implements key safety analysis methods (HAZOP, FTA, FMEA, FMEDA) all in one integrated tool. It supports the efficient and consistent execution of the safety-related activities that are required by applicable safety standards. medini analyze is well integrated with other engineering tools and enables safety analysis based on design models by utilizing standards like SysML.
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Digital twin system modeling and analysis platform can quickly analyze system response, perform remote system monitoring, real-time model calculation and other functions.
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Digital Mission Engineering |
Academic Products |
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Software for digital mission engineering and systems snalysis.
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Ansys Academic solutions empower educators, students, and academic researchers to explore, design, and innovate across every field of engineering and science. With a wide range of simulation tools—spanning structures, fluids, electronics, optics, materials, and more—Ansys provides scalable bundles for teaching and research.
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Other CAE Tools |
Cloud Services |
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Multi-scale material design and simulation add-in tool embedded in Ansys Workbench environment.
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Flexible, secure, and validated cloud envirenment optimized for CAE analysis.
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