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Techincal Center

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Technical Center

【Webinar File】Simulation – Key to Better Engineering - Solution introduction


CAE Simulation: The key to better engineering
– Learn the innovated engineering stories with Ansys expert

【Technical notes】Reflow solution of LED mounting component


Using Ansys for simulation from thermal fluid analysis to thermal stress analysis around mounted components

【Technical notes】Fluid–structure interaction analysis of MEMS mirror device


By using the two way FSI (Fluid-Structure Interaction) analysis of Ansys, it is possible to perform analysis that takes into account the viscosity of air, and obtain highly accurate vibration characteristics of the device.

【Technical articles】Evaluation of Torricelli’s law through experiment and CFD(Computational Fluid Dynamics).


This article is the final year project of Malaysia Japan Higher Education Program supporting by CYBERNET Malaysia Ansys expert, talking about experimental study of providing the equation of Torricelli law through through experiment and using Ansys CFD
【Courtesy of MJHEP(Malaysia Japan Higher Education Program)】

【Technical notes】Crack growth analysis of solder balls


Using Ansys Mechanical Enterprise to analyze crack growth of solder balls